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| oH VE S CO AV R M AI SIO PL LA N IA BL S NT E TISP7015L1, TISP7038L1 TRIPLE ELEMENT THYRISTOR OVERVOLTAGE PROTECTORS *R TISP70xxL1 (VLV) OvervoltageProtectors Three Terminal Very Low Voltage (VLV) Protection Ion-Implanted Breakdown Region Device `7015L1 `7038L1 VDRM V 8 28 V(BO) V 15 38 D Package (Top View) T1 NC NC T2 1 2 3 4 8 7 6 5 NC NC G NC MD7XAJA Protection for Signal, Data and Control Lines - ISDN - T1/E1 - Ethernet - RS232 & RS485 Low Capacitance - `7015L1 ...................................................................... 24 pF typ. - `7038L1 ...................................................................... 17 pF typ. Rated for International Surge Wave Shapes Voltage Waveshape 2/10 1.2/50 10/700 10/1000 Standard GR-1089-CORE IEC 61000-4-5 TIA/EIA-IS-968 ITU-T K.20/45/21 GR-1089-CORE IPPSM A 200 100 50 NC - No internal connection Device Symbol T1 T2 SD7XAD G 30 IEC 61000-4-2 Immunity Ratings Contact ................................................................................. 6 kV Air .......................................................................................... 8 kV ............................................ UL Recognized Components Description The TISP70xxL1 series are 3-point overvoltage protectors designed for protecting against metallic (transverse mode) and simultaneous longitudinal (common mode) impulses. Each terminal pair has the same voltage limiting values and surge current capability. These devices are designed to limit overvoltages between signal, data and control port conductors, connected to terminals T1 and T2, and a protective ground, G. Each terminal pair has a symmetrical voltage-triggered bidirectional thyristor characteristic (Figure 1). Overvoltages are initially clipped by breakdown clamping until the voltage rises to the breakover level, which causes the device to crowbar into a low-voltage on state. This low-voltage on state causes the current resulting from the overvoltage to be safely diverted through the device. The device holding current will normally be higher than the available short circuit d.c. system current, causing the protector to switch off as the diverted current subsides. How To Order For Standard Termination Finish Order As TISP7015L1DR TISP7015L1D TISP7038L1DR TISP7038L1D Device TISP7015L1 Package D (8-pin, Small-outline) Carrier R (Embossed Tape Reeled) Tube R (Embossed Tape Reeled) Tube For Lead Free Termination Finish Order As TISP7015L1DR-S TISP7015L1D-S TISP7038L1DR-S TISP7038L1D-S TISP7038L1 D (8-pin, Small-outline) *RoHS Directive 2002/95/EC Jan 27 2003 including Annex JULY 2000 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP70xxL1 (VLV) OvervoltageProtectors The TISP70xxL1 is guaranteed to withstand the listed international ESD (ElectroStatic Discharge), and lightning impulses in both polarities. Terminals marked NC do not have any internal connections and may be left floating or tied to some circuit point. The TISP7038L1 is a functional replacement for the TPN3021. Absolute Maximum Ratings, TJ = 25 C (Unless Otherwise Noted) Rating Repetitive peak off-state voltage Non-repetitive peak on-state pulse current (see Notes 1 and 2) 2/10 (Telcordia GR-1089-CORE, 2/10 voltage wave shape) 1/20 (ITU-T K.22, 1.2/50 voltage wave shape, also VDE0878) 8/20 (IEC 61000-4-5, Figure 12 generator, 1.2/50 voltage wave shape) 10/160 (TIA/EIA-IS-968 (formally FCC Part 68), 10/160 voltage wave shape) 5/310 (ITU-T k.20/21, 10/700 voltage wave shape, also IEC 61000-4-5 and VDE0433) 10/560 (TIA/EIA-IS-968 (formally FCC Part 68), 10/560 voltage wave shape) 10/1000 (Telcordia GR-1089-CORE, 10/1000 voltage wave shape) Non-repetitive peak on-state current (see Note 1) 16.7 ms (60 Hz) full sine wave 20 ms (50 Hz) full sine wave 0.2 s 50 Hz/60 Hz a.c. 2.0 s 50 Hz/60 Hz a.c. Junction temperature Storage temperature range TJ Tstg ITSM 9 8 3 1.5 -40 to +150 -65 to +150 C C A IPPSM 200 100 100 75 50 40 30 A TISP7015L1 TISP7038L1 Symbol VDRM Value 8 28 Unit V NOTES: 1. Initially the TISP70xxL1 must be in thermal equilibrium at the specified TA. The surge may be repeated after the TISP70xxL1 returns to its initial conditions. 2. These non-repetitive rated currents are peak values of either polarity. EMC Immunity Test Ratings, TA = 25 C (Unless Otherwise Noted) Rating Level 3 open-circuit voltage, IEC 61000-4-2, 2001-4, ESD generator, also ITU-T K.20 contact discharge air discharge VO/C 6 8 kV Symbol Value Unit Electrical Characteristics, TJ = 25 C (Unless Otherwise Noted) Parameter IDRM V(BO) I (BO) IH Repetitive peak offstate current Breakover voltage Breakover current Holding current VD = VDRM dv/dt = 250 V/ms, RSOURCE = 300 dv/dt = 250 V/ms, RSOURCE = 300 IT = 5 A, di/dt = 30 mA/ms 30 TISP7015L1 TISP7038L1 Test Conditions Min Typ Max 4 15 38 300 Unit A V mA mA JULY 2000 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP70xxL1 (VLV) OvervoltageProtectors Electrical Characteristics, TJ = 25 C (Unless Otherwise Noted) (Continued) Parameter C KA Off-state capacitance Test Conditions f = 1 MHz, Vd = 1 V rms, VD = 0 (see Note 3) TISP7015L1 TISP7038L1 Min Typ 24 17 Max Unit pF NOTE 3: Value for any terminal pair, three-terminal guarded measurement with zero voltage bias on the unmeasured terminal. Thermal Characteristics Parameter R JA Junction to free air thermal resistance Test Conditions Ptot = 0.8 W, TA = 25 C, 5 cm2, FR4 PCB Min Typ Max 170 Unit C/W JULY 2000 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP70xxL1 (VLV) OvervoltageProtectors Parameter Measurement Information +i I PPSM Quadrant I Switching Characteristic ITSM V(BO) IH IDRM -v VDRM IDRM IH VD ID ID VD VDRM +v I(BO) I(BO) V(BO) ITSM Quadrant III Switching Characteristic IPPSM -i PM7AC Figure 1. Voltage-Current Characteristic for any Terminal Pair JULY 2000 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP70xxL1 (VLV) OvervoltageProtectors Typical Characteristics OFF-STATE CURRENT vs JUNCTION TEMPERATURE 10000 VD = 50 V TC7LVC NORMALIZED BREAKOVER VOLTAGE vs JUNCTION TEMPERATURE 1.10 TC7LVE 1000 Normalized Breakover Voltage ID - Off-State Current - nA '7038L1 1.05 100 1.00 '7015L1 10 '7015L1 '7038L1 1 0 50 100 TA - Ambient Temperature - C 150 0.95 -25 0 25 50 75 100 125 TJ - Junction Temperature - C 150 Figure 2. Figure 3. ON-STATE CURRENT vs ON-STATE VOLTAGE 100 tw = 100 s TA = 25 C TC7LVB 2 NORMALIZED HOLDING CURRENT vs JUNCTION TEMPERATURE TC7LVD 10 Normalized Holding Current 1.5 IT - On-State Current - A 1 0.9 0.8 0.7 0.6 0.5 1 0.1 1 2 3 4 5 6 7 8 910 VT - On-State Voltage - V 20 0.4 -25 0 25 50 75 100 125 TJ - Junction Temperature - C 150 Figure 4. Figure 5. JULY 2000 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP70xxL1 (VLV) OvervoltageProtectors Typical Characteristics CAPACITANCE vs OFF-STATE VOLTAGE 30 TC7L1AA '7015L1 Coff - Capacitance - pF 20 10 9 8 7 6 5 0.1 '7038L1 0.2 0.3 0.5 1 23 5 10 VD - Off-State Voltage - V 20 30 50 Figure 6. JULY 2000 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP70xxL1 (VLV) OvervoltageProtectors Rating and Thermal Information NON-REPETITIVE PEAK ON-STATE CURRENT vs CURRENT DURATION ITSM(t) - Non-Repetitive Peak On-State Current - A 30 20 15 10 9 8 7 6 5 4 3 2 1.5 1 0.01 VGEN = 600 Vrms, 50/60 Hz RGEN = 1.4*VGEN/ITSM(t) EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 C TI7MAI VDRM DERATING FACTOR vs MINIMUM AMBIENT TEMPERATURE 1.00 TI7LVA 0.99 Derating Factor '7015L1 0.98 0.97 '7038L1 0.96 0.1 1 10 100 t - Current Duration - s 1000 0.95 -40 -35 -30 -25 -20 -15 -10 -5 0 5 10 15 20 25 TAMIN - Minimum Ambient Temperature - C Figure 7. Figure 8. JULY 2000 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP70xxL1 (VLV) OvervoltageProtectors MECHANICAL DATA Device Symbolization Code Devices will be coded as below. Device TISP7015L1 TISP7038L1 Symbolization Code 7015L1 7038L1 JULY 2000 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP70xxL1 (VLV) OvervoltageProtectors MECHANICAL DATA D008 Plastic Small-outline Package This small-outline package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly. D008 4.80 - 5.00 (0.189 - 0.197) 8-pin Small Outline Microelectronic Standard Package MS-012, JEDEC Publication 95 8 7 6 5 5.80 - 6.20 (0.228 - 0.244) INDEX 3.81 - 4.00 (0.150 - 0.157) 1 2 3 4 1.35 - 1.75 (0.053 - 0.069) 7 NOM 3 Places 0.25 - 0.50 x 45 N0M (0.010 - 0.020) 4.60 - 5.21 (0.181 - 0.205) 0.102 - 0.203 (0.004 - 0.008) 0.28 - 0.79 (0.011 - 0.031) Pin Spacing 1.27 (0.050) (see Note A) 6 places 0.36 - 0.51 (0.014 - 0.020) 8 Places 0.190 - 0.229 (0.0075 - 0.0090) 7 NOM 4 Places 0.51 - 1.12 (0.020 - 0.044) 44 DIMENSIONS ARE: MILLIMETERS (INCHES) NOTES: A. B. C. D. Leads are within 0.25 (0.010) radius of true position at maximum material condition. Body dimensions do not include mold flash or protrusion. Mold flash or protrusion shall not exceed 0.15 (0.006). Lead tips to be planar within 0.051 (0.002). MDXXAA E JULY 2000 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP70xxL1 (VLV) OvervoltageProtectors MECHANICAL DATA D008 Tape DImensions D008 Package (8-pin Small Outline) Single-Sprocket Tape 3.90 - 4.10 (.154 - .161) 7.90 - 8.10 (.311 - .319) 1.95 - 2.05 (.077 - .081) 1.50 - 1.60 (.059 - .063) 0.40 (.016) 0.8 MIN. (.03) 5.40 - 5.60 (.213 - .220) 11.70 - 12.30 (.461 - .484) 6.30 - 6.50 (.248 - .256) o 1.50 MIN. (.059) 0 MIN. Direction of Feed Cover Tape Carrier Tape Embossment 2.0 - 2.2 (.079 - .087) DIMENSIONS ARE: MILLIMETERS (INCHES) NOTES: A. Taped devices are supplied on a reel of the following dimensions:Reel diameter: Reel hub diameter: Reel axial hole: 330 +0.0/-4.0 (12.99 +0.0/-.157) 100 2.0 (3.937 .079) 13.0 0.2 (.512 .008) MDXXATC B. 2500 devices are on a reel. "TISP" is a trademark of Bourns, Ltd., a Bourns Company, and is Registered in U.S. Patent and Trademark Office. "Bourns" is a registered trademark of Bourns, Inc. in the U.S. and other countries. JULY 2000 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. |
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